Embarking on Possibility: NVIDIA AI Summit Recap

I’m a Product Manager for SealingTech and this past October, I attended NVIDIA’s invitation-only Artificial Intelligence (AI) Summit in Washington DC with my team. We demonstrated SealingTech’s latest AI innovations at the conference along with our GN 7000 advanced server for AI/ML edge computing.  

The NVIDIA AI Summit featured valuable insights from industry leaders on AI in over 50 sessions, live demos, and hands-on workshops.

While at the AI Summit, my team and I engaged with folks from a variety of industries and DoD agencies including the Army, Air Force, and NASA who wanted to learn about SealingTech’s latest innovations and were drawn to our booth by the form factor design of our Cyber–Fly–Away Kits. We discussed how we’re developing and deploying custom AI/ML systems to help identify anomalies and enhance cybersecurity defenses with proactive threat detection and mitigation. 

Our Carry-On Compliant Form Factor 

We also met other individuals in support of the Federal Government’s Offensive Cyber Operators who wanted to see our gear and the GN 7000 form factor in action. Our robust form factor comes equipped with a powerful 64-core AMD EPYC processor, NVMe removable storage, high-speed networking adapters, an NVIDIA H100 GPU for AI/ML workloads, and an optional NVIDIA BlueField-3 DPU.  

I was thrilled to see the extent of interest in our GN 7000, especially around its compact size being able to house an H100 GPU in an edge system—a capability that everyone was excited to see. 

Things I Learned 

Sessions covered generative AI, remote sensing, cybersecurity, robotics, industrial digitalization, and more.

While at the summit, I attended the session: Semiconductor Manufacturing for the AI Supply Chain led by NVIDIA’s Director of Technical Policy, Eric Breckenfeld and Brad Koenig, former Senior Relationship Director for US Department of Commerce, NIST-CHIPS Program Office.  

The CHIPS and Science Act of 2022 established funding for the Creating Helpful Incentives to Produce Semiconductors (CHIPS) for the America Defense Fund to carry out the National Network for Microelectronics Research and Development (R&D). The Act authorized $280 billion in new funding to boost domestic research and manufacturing of semiconductors, and support critical industries from automobiles and medical devices to artificial intelligence and aerospace. 

This new law went way beyond advanced wafer production by allocating $50 billion toward supply chain resiliency, with about $12 billion for wafer design R&D. Approximately $38 billion was earmarked for advanced manufacturing, current node manufacturing, advanced chip packaging, and standard chip packaging. However, the bill failed to provide funding to power these supercomputing centers and newer chips which could significantly impact our customers and critical Infrastructure. 

The need for power goes beyond the physical powering of a plant. As large chip manufacturers look to move out of Taiwan, these companies will make their decisions based on geographical security/stability, access to power and cooling, access to raw materials, and overall tax credits or advantages. If the U.S. is not well positioned in these areas, companies will look to the European and or other Asian Pacific regions who are willing to deal. 

With the growth of electric vehicles and medical devices, the demand for electricity consumption continues to soar significantly. SealingTech and Parsons remain focused on safeguarding critical infrastructure and advancing operational technology (OT) through its continued R&D and innovative defensive solutions. It’s never been more imperative for us to work together in securing our customers’ networks and systems in the electrical distribution network.  

Want to learn more about SealingTech’s AI/ML defensive capabilities? Connect with our team.